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3D Interconnect Architectures for Heterogeneous Technologies

Name: 3D Interconnect Architectures for Heterogeneous Technologies
Brand: Springer, Berlin
SKU: 43632363
Price: 123.73 EUR
Availability: InStock
Author: Lennart Bamberg
ISBN: 9783030982317

Modeling and Optimization

Jezik

Engleski

Knjiga Meki uvez

Libristo kod: 43632363

Nakladnici Springer, Berlin, srpanj 2023

This book describes the first comprehensive approach to the optimization of interconnect architectur... Cijeli opis

Libristo kod: 43632363

299 b

123.73 €

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This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow's 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.