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3D Stacked Chips

Name: 3D Stacked Chips
Brand: Springer International Publishing AG
SKU: 19684593
Price: 50.47 EUR
Availability: InStock
Author: IBRAHIM AB ELFADEL
ISBN: 9783319793054

From Emerging Processes to Heterogeneous Systems

IBRAHIM AB ELFADEL

Jezik

Engleski

Knjiga Meki uvez

Libristo kod: 19684593

Nakladnici Springer International Publishing AG, svibanj 2018

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integrati... Cijeli opis

Libristo kod: 19684593

122 b

50.47 €

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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.