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This volume is the 12th in a successful series previously known as Advanced Metallization for ULSI Applications. The addition of Interconnect Systems to the conference name is indicative of the growth and venue of topics which have been incorporated into the conference over the past several years. The volume features a keynote address on "Process Technologies for High-Performance Multilevel Metallization Schemes" and a special section on low-k dielectric materials and systems.
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