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Electromigration is a microscopic phenomenon §involving electric field-induced diffusion, which is §very relevant to damage in interconnections. A §common method for monitoring interconnection §degradation is through electrical resistance §measurements, which requires direct electrical §contact. It is desirable to develop non-contact §methods to monitor electromigration damage §formation. In this thesis, we propose a novel §Optical Microscopy Imaging Method (OMIM), and we §provide a theoretical description and experimental §results. OMIM not only provides a new method for §studying electromigration, but also provides a §useful method for studying other micro-devices and §materials in a non- contact mode.
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