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Knjiga Semiconductor Packaging Randy Hsiao-Yu Lo

Semiconductor Packaging

Materials Interaction and Reliability

Randy Hsiao-Yu Lo

Jezik

Engleski

Knjiga Tvrdi uvez

Knjiga Semiconductor Packaging Randy Hsiao-Yu Lo

Libristo kod: 06721699

Nakladnici Taylor & Francis Inc, listopad 2011

In semiconductor manufacturing, understanding how various materials behave and interact is critical...

Libristo kod: 06721699

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundame

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Informacije o knjizi

Puni naziv Semiconductor Packaging

Autor Randy Hsiao-Yu Lo

Jezik

Engleski

Uvez Knjiga - Tvrdi uvez

Datum izdanja 2011

Broj stranica 216

EAN 9781439862056

ISBN 9781439862056

Libristo kod 06721699

Nakladnici Taylor & Francis Inc

Težina 472

Dimenzije 156 x 241 x 17

Kategorija

Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronic devices & materials

Technology, Engineering, Agriculture > Mechanical engineering & materials > Materials science

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