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The study of thermal mismatch induced stresses and their role in mechanical failure is one of the significant topics to composite materials and electronic packages. An understanding of the nature of the interfacial stresses under different temperature conditions is necessary in order to minimize or eliminate the risk of mechanical failure in electronic packaging industries. An accurate assessment of thermal stresses in the interfaces plays an important role in the design and reliability studies of micro-electronic devices. Therefore, in the microelectronic industry, from a practical point of view, there is a need for simple and powerful analytical models to determine interfacial stresses in layered structures quickly and accurately. This book presents a comprehensive analytical model for interfacial thermal stresses in a multi-layered electronic assembly. Selection of packaging material properties and geometries for optimum mechanical performance of the device are featured in the book. This book should prove to be an ideal text for undergraduates, postgraduates and practicing engineers.
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