Kontakt
Kako kupovati
Dostava
Savjetnik za kupnju
Engleski
183 b
30 dana za povrat kupljenih proizvoda
Kupci su kupili i
/
Meki uvez
45.06
€
/
Meki uvez
14.27
€
/
Kalendar
30.98
€
/
Meki uvez
38.17
€
/
Meki uvez
52.66
€
/
Meki uvez
23.08
€
With the decrease in feature size of CMOS integrated §circuits, interconnect design has become an §important issue in high speed, high complexity §integrated circuits. Different design methodologies §have been proposed to improve circuit performance. §Wire sizing, driver sizing, repeater insertion, and §wire shaping are common techniques to enhance §circuit performance.§ With increasing signal frequencies and the §corresponding decrease in signal transition times, §the interconnect impedance can behave inductively. §Line inductance introduces new tradeoffs in §interconnect design and driver sizing to decrease §the circuit delay. Different design methodologies §under an inductive environment are described in this §book. Including line inductance in the design §process can enhance both the delay and power as well §as improve the accuracy of the overall design §process. By including the on-chip inductance, the §efficiency of different circuit design techniques §such as wire sizing, driver sizing, repeater §insertion, and line tapering can be greatly §enhanced.
Informacije o knjizi
Engleski
Poklonite ovu knjigu još danas
To je jednostavno
1 Dodajte knjigu u košaricu i odaberite isporuku kao poklon 2 Zauzvrat ćemo vam poslati kupon 3 Knjiga dolazi na adresu poklonoprimcaMoglo bi vas zanimati i
/
Meki uvez
50.63
€
/
Meki uvez
22.07
€
/
Tvrdi uvez
235.27
€
/
Tvrdi uvez
31.69
€
Dobar dan! Ja sam Libroamiko, vaš književni savjetnik.
Kako vam mogu pomoći?